Fusion soldering and solder ball jet soldering for delicate electronics — heat exactly where you need it, nowhere else. The joining method behind modern earphones, camera modules and wearables.
Laser heats solder wire or preforms directly at the joint — controlled thermal profiles for connectors, flex cables and fine-pitch pads without stressing nearby components.
A precisely-sized solder ball is melted by laser and jetted onto the pad — perfect for joints that irons and hot air can never reach, such as inside earphone assemblies and camera modules.
No physical tip touches the joint — zero mechanical stress on fine wires and miniature components.
Energy is delivered only to the solder joint, protecting heat-sensitive parts just millimetres away.
Solder ball and fusion soldering inside earphone drivers, wearable devices and other space-constrained 3C assemblies.
Closed-loop temperature control produces uniform joints across long production runs.
Easily integrated into automated lines and selective soldering cells for high-mix production.
Precise thermal profiles handle modern lead-free solder alloys without overheating boards.
Tell us your assembly and joint size — we'll propose fusion or jet soldering and arrange a process demonstration.
